商业快报

Intel seals $30bn partnership with Brookfield to fund chip factories

Plans feed into wider effort to boost manufacturing and regain market share from Samsung and TSMC

Intel has struck a partnership with Brookfield Infrastructure Partners to fund the development of a $30bn semiconductor fabrication plant in Arizona, as the chipmaker works to finance construction on large domestic manufacturing facilities following the approval of landmark semiconductor legislation in the US.

Brookfield is investing $15bn for a 49 per cent stake in Intel’s expansion of its Arizona site, and brings experience in developing infrastructure assets such as transmission lines, data centres and wireless cell towers. Intel, which described the partnership as “a new funding model to the capital-intensive semiconductor industry”, will retain a 51 per cent stake.

“Our agreement with Brookfield is a first for our industry, and we expect it will allow us to increase flexibility while maintaining capacity on our balance sheet to create a more distributed and resilient supply chain,” Intel chief financial officer David Zinsner said.

您已阅读27%(947字),剩余73%(2613字)包含更多重要信息,订阅以继续探索完整内容,并享受更多专属服务。
版权声明:本文版权归manbetx20客户端下载 所有,未经允许任何单位或个人不得转载,复制或以任何其他方式使用本文全部或部分,侵权必究。
设置字号×
最小
较小
默认
较大
最大
分享×